Contact Material
Beryllium Copper
Card Thickness
0.062" (1.57mm)
Features
Bi-Level - High Density
Mfr
Sullins Connector Solutions
Mounting Type
Through Hole, Right Angle
Base Product Number
ABB38
Number of Positions/Bay/Row
38
Operating Temperature
-65°C ~ 150°C
Card Type
Non Specified - Dual Edge, Bi-Level
Contact Finish Thickness
10.0µin (0.25µm)
Flange Feature
Side Mount Opening, Unthreaded, 0.125" (3.18mm) Dia
Material - Insulation
Polyamide (PA9T), Polyphenylene Sulfide (PPS)