Contact Material
Beryllium Copper
Card Thickness
0.062" (1.57mm)
Contact Finish Thickness
30.0µin (0.76µm)
Flange Feature
Top Mount Opening, Unthreaded, 0.125" (3.18mm) Dia
Material - Insulation
Polybutylene Terephthalate (PBT)
Number of Positions/Bay/Row
18
Mounting Type
Panel Mount
Operating Temperature
-65°C ~ 125°C
Mfr
Sullins Connector Solutions
Termination
Solder Eyelet(s)
Contact Type
Full Bellows
Base Product Number
HMM18
Card Type
Non Specified - Dual Edge